Semiconductor Device Modeling With SPICE
Author | : |
Publisher | : Tata McGraw-Hill Education |
Total Pages | : 0 |
Release | : |
Genre | : |
ISBN | : 9780071070515 |
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Author | : |
Publisher | : Tata McGraw-Hill Education |
Total Pages | : 0 |
Release | : |
Genre | : |
ISBN | : 9780071070515 |
Author | : Giuseppe Massabrio |
Publisher | : McGraw Hill Professional |
Total Pages | : 500 |
Release | : 1998-12-22 |
Genre | : Technology & Engineering |
ISBN | : 9780071349550 |
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
Author | : Giuseppe Massobrio |
Publisher | : |
Total Pages | : 479 |
Release | : 1993 |
Genre | : SPICE (Computer file) |
ISBN | : 9780071132008 |
Author | : Paolo Antognetti |
Publisher | : |
Total Pages | : 389 |
Release | : 1988 |
Genre | : SPICE (Computer program). |
ISBN | : 9780071001212 |
Author | : Tor A. Fjeldly |
Publisher | : Wiley-Interscience |
Total Pages | : 440 |
Release | : 1998 |
Genre | : Computers |
ISBN | : |
This book is a useful reference for practicing electrical engineers as well as a textbook for a junior/senior or graduate level course in electrical engineering. The authors combine two subjects: device modeling and circuit simulation - by providing a large number of well-prepared examples of circuit simulations immediately following the description of many device models.
Author | : Daniel Foty |
Publisher | : Prentice Hall |
Total Pages | : 680 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : |
This book will help CMOS circuit designers make the best possible use of SPICE models, and will prepare them for new models that may soon be introduced. Introduces SPICE modeling and its use in CMOS circuit design. Presents the formalism of model building and the semiconductor physics of MOS structures. Covers each important SPICE model, showing how to choose the appropriate model. Discusses the popular HSPICE Level 28, as well as Levels 1-3, BSIM 1-3, and MOS Model 9. Presents techniques for accounting for systematic process variations. Describes new model candidates, including the Power-Lane Model, the PCIM Model, and the EKV Model. Includes extensive examples throughout. Practicing engineers and scientists in the semiconductor industry; engineering faculty and students.
Author | : NANDITA DASGUPTA |
Publisher | : PHI Learning Pvt. Ltd. |
Total Pages | : 342 |
Release | : 2004-01-01 |
Genre | : Technology & Engineering |
ISBN | : 812032398X |
Aimed primarily at the undergraduate students pursuing courses in semiconductor physics and semiconductor devices, this text emphasizes the physical understanding of the underlying principles of the subject. Since engineers use semiconductor devices as circuit elements, device models commonly used in the circuit simulators, e.g. SPICE, have been discussed in detail. Advanced topics such as lasers, heterojunction bipolar transistors, second order effects in BJTs, and MOSFETs are also covered. With such in-depth coverage and a practical approach, practising engineers and PG students can also use this book as a ready reference.
Author | : Rachel Lee |
Publisher | : |
Total Pages | : |
Release | : 1993-08 |
Genre | : |
ISBN | : 9780131208094 |
Author | : Muhammad H. Rashid |
Publisher | : CRC Press |
Total Pages | : 563 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 1351833049 |
Power electronics can be a difficult course for students to understand and for professors to teach. Simplifying the process for both, SPICE for Power Electronics and Electric Power, Third Edition illustrates methods of integrating industry standard SPICE software for design verification and as a theoretical laboratory bench. Helpful PSpice Software and Program Files Available for Download Based on the author Muhammad H. Rashid’s considerable experience merging design content and SPICE into a power electronics course, this vastly improved and updated edition focuses on helping readers integrate the SPICE simulator with a minimum amount of time and effort. Giving users a better understanding of the operation of a power electronics circuit, the author explores the transient behavior of current and voltage waveforms for each and every circuit element at every stage. The book also includes examples of all types of power converters, as well as circuits with linear and nonlinear inductors. New in this edition: Student learning outcomes (SLOs) listed at the start of each chapter Changes to run on OrCAD version 9.2 Added VPRINT1 and IPRINT1 commands and examples Notes that identify important concepts Examples illustrating EVALUE, GVALUE, ETABLE, GTABLE, ELAPLACE, GLAPLACE, EFREQ, and GFREQ Mathematical relations for expected outcomes, where appropriate The Fourier series of the output voltages for rectifiers and inverters PSpice simulations of DC link inverters and AC voltage controllers with PWM control This book demonstrates techniques of executing power conversions and ensuring the quality of the output waveforms rather than the accurate modeling of power semiconductor devices. This approach benefits students, enabling them to compare classroom results obtained with simple switch models of devices. In addition, a new chapter covers multi-level converters. Assuming no prior knowledge of SPICE or PSpice simulation, the text provides detailed step-by-step instructions on how to draw a schematic of a circuit, execute simulations, and view or plot the output results. It also includes suggestions for laboratory experiments and design problems that can be used for student homework assignments.
Author | : Tibor Grasser |
Publisher | : Springer |
Total Pages | : 518 |
Release | : 2014-10-29 |
Genre | : Technology & Engineering |
ISBN | : 3319089943 |
This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.