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| Author | : 高田隆裕 |
| Publisher | : |
| Total Pages | : 134 |
| Release | : 2003 |
| Genre | : |
| ISBN | : |
| Author | : R. Saravanan |
| Publisher | : Materials Research Forum LLC |
| Total Pages | : 167 |
| Release | : 2018-02-25 |
| Genre | : Technology & Engineering |
| ISBN | : 1945291559 |
Barium titanate is one of the most important electronic materials; due to its high permittivity, low dielectric loss and high tunability. The environment friendly material is suitable for microphones and microwave device applications such as tunable capacitors, delay lines, filters, resonators and phase shifters. Doped titanates are extensively used for various electronic devices, such as transducers, piezoelectric actuators, passive memory storage devices, dynamic random access memory (DRAM), multilayer ceramic capacitors (MLCCs), positive temperature coefficient resistors (PTCR), optoelectronic devices and infrared sensors. The book presents research results concerning the electron density distribution in a number of doped barium titanate ceramic materials using experimental X-ray diffraction data, UV-visible spectrophotometry (UV-vis), scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The analysis of interatomic bonding and electron density distribution is important for predicting the properties of potentially important materials and has previously been lacking for the materials studied. Barium Titanate, Barium Titanate Doping, Dielectric Ceramics, Permittivity, Tunability, Transducers, Piezoelectric Actuators, Memory Storage Devices, Multilayer Ceramic Capacitors, Optoelectronic Devices, X-Ray Diffraction Data, UV-Visible Spectrophotometry, Energy Dispersive X-Ray Spectroscopy, Interatomic Bonding, Electron Density Distribution, Ceramic Property Predictions.
| Author | : K. M. Nair |
| Publisher | : John Wiley & Sons |
| Total Pages | : 323 |
| Release | : 2012-04-11 |
| Genre | : Technology & Engineering |
| ISBN | : 1118408179 |
This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
| Author | : K. M. Nair |
| Publisher | : John Wiley & Sons |
| Total Pages | : 416 |
| Release | : 2012-04-11 |
| Genre | : Technology & Engineering |
| ISBN | : 1118408195 |
Papers in this volume include topics such as materials synthesis and processing; relaxors; novel compositions; material design; materials for multilayer electronic devices; processing-microstructure-property relationship; applications; environmental issues; and economic/cost analysis of tomorrow's electronic devices. Includes 38 papers.
| Author | : Mailadil T. Sebastian |
| Publisher | : John Wiley & Sons |
| Total Pages | : 997 |
| Release | : 2017-03-02 |
| Genre | : Technology & Engineering |
| ISBN | : 1119208564 |
Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
| Author | : K. M. Nair |
| Publisher | : John Wiley & Sons |
| Total Pages | : 276 |
| Release | : 2010-12-08 |
| Genre | : Technology & Engineering |
| ISBN | : 0470930969 |
During the past decades, understanding of the science and technology powering electronic materials has played a major role in satisfying social needs by developing electronic devices for automotive, telecommunications, military, and medical applications. This volume contains a collection of selected papers from the international symposia on Advanced Dielectric Materials and Electronic Devices and Ferroelectrics and Multiferroics presented during the Material Science and Technology conference held in Pittsburgh in October 2009. It is a one-stop resource for academics on the most important issues in advances in electroceramic materials.
| Author | : Dalveer Kaur |
| Publisher | : |
| Total Pages | : 200 |
| Release | : 2016-08-04 |
| Genre | : |
| ISBN | : 9783659919589 |
| Author | : Mailadil T. Sebastian |
| Publisher | : John Wiley & Sons |
| Total Pages | : 1000 |
| Release | : 2017-03-02 |
| Genre | : Technology & Engineering |
| ISBN | : 1119208556 |
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
| Author | : Mauro DiDomenico (Jr.) |
| Publisher | : |
| Total Pages | : 176 |
| Release | : 1962 |
| Genre | : Barium titanate |
| ISBN | : |
The results of a program which led to the construction of a high density large capacity thermoplastic film digital memory are summarized in this report. The equipment was constructed as a laboratory model and occupies five cabinets. More extensive utilization of semi-conductors throughout the circuit design could result in future models of one-half this physical size. The basic purpose was to demonstrate the feasibility of thermoplastic film for use as the mass data storage medium in conjunction with digital computer applications; partiularly where read access must be rapid and random and where writing and updating of data can occr at infrequent and panned intervals. The storage medium is thermoplastic film carried on a 1/8-inch thick glass plate. Recording occurs in a vauum. An electron beam is swept in rasterform across the surface. The beam is modulated in accordance with the data being stored. Several moduation methods were investigated. (Author).
| Author | : Ronald Krueger |
| Publisher | : |
| Total Pages | : 66 |
| Release | : 2002 |
| Genre | : |
| ISBN | : |
An overview of the virtual crack closure technique is presented. The approach used is discussed, the history summarized, and insight into its applications provided. Equations for two-dimensional quadrilateral elements with linear and quadratic shape functions are given. Formula for applying the technique in conjuction with three-dimensional solid elements as well as plate/shell elements are also provided. Necessary modifications for the use of the method with geometrically nonlinear finite element analysis and corrections required for elements at the crack tip with different lengths and widths are discussed. The problems associated with cracks or delaminations propagating between different materials are mentioned briefly, as well as a strategy to minimize these problems. Due to an increased interest in using a fracture mechanics based approach to assess the damage tolerance of composite structures in the design phase and during certification, the engineering problems selected as examples and given as references focus on the application of the technique to components made of composite materials.
