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Interconnect Technologies for Integrated Circuits and Flexible Electronics

Interconnect Technologies for Integrated Circuits and Flexible Electronics
Author: Yash Agrawal
Publisher: Springer Nature
Total Pages: 286
Release: 2023-10-17
Genre: Technology & Engineering
ISBN: 9819944767

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This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.


Interconnect Technologies for Integrated Circuits and Flexible Electronics

Interconnect Technologies for Integrated Circuits and Flexible Electronics
Author: Yash Agrawal
Publisher: Springer
Total Pages: 0
Release: 2023-10-07
Genre: Technology & Engineering
ISBN: 9789819944750

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This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.


Interconnect Technology and Design for Gigascale Integration

Interconnect Technology and Design for Gigascale Integration
Author: Jeffrey A. Davis
Publisher: Springer Science & Business Media
Total Pages: 417
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1461504619

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This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.


A Flexible Interconnection for Integrated Circuits

A Flexible Interconnection for Integrated Circuits
Author: Qingqi Wang
Publisher:
Total Pages: 126
Release: 1997
Genre:
ISBN:

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The semiconductor industry has developed at an unprecedented rate in the past two decades. Newer technology innovations have enabled the design of more complex structures. However, those IC chips are mostly fabricated on thick crystalline substrates and are not physically flexible. Flexibility of integrated circuits is very important in designing some devices such as small microprobes, sensors and disk drive flexible read/write assemblies. This thesis covers the study, analysis and fabrication of a flexible interconnection method for integrated circuits. Following standard processing steps of a commercial integrated circuit chip, an etching step is added to fabricate a flexible interconnection. This work starts with an investigation of a mechanical model in flexible interconnection design, which is a wide beam with applied moments. Theoretical calculations and tool simulations are provided to give a correct picture of bending an interconnecting membrane.


Ultra-thin Chip Technology and Applications

Ultra-thin Chip Technology and Applications
Author: Joachim Burghartz
Publisher: Springer Science & Business Media
Total Pages: 471
Release: 2010-11-18
Genre: Technology & Engineering
ISBN: 1441972765

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Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.


Electronic Equipment Packaging Technology

Electronic Equipment Packaging Technology
Author: Gerald L. Ginsberg
Publisher: Springer Science & Business Media
Total Pages: 285
Release: 2013-11-27
Genre: Science
ISBN: 1461535425

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The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in deter mining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to pro vide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.


Flexible Electronics

Flexible Electronics
Author: YongAn Huang
Publisher: Springer Nature
Total Pages: 423
Release: 2023-01-01
Genre: Science
ISBN: 9811966230

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Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design like liquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.


High-speed Integrated Circuit Technology

High-speed Integrated Circuit Technology
Author: Mark J. W. Rodwell
Publisher: World Scientific
Total Pages: 374
Release: 2001
Genre: Technology & Engineering
ISBN: 9789812810014

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This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology. Contents: Preface (M J W Rodwell); High-Speed and High-Data-Bandwidth Transmitter and Receiver for Multi-Channel Serial Data Communication with CMOS Technology (M Fukaishi et al.); High-Performance Si and SiGe Bipolar Technologies and Circuits (M Wurzer et al.); Self-Aligned Si BJT/SiGe HBT Technology and Its Application to High-Speed Circuits (K Washio); Small-Scale InGaP/GaAs Heterojunction Bipolar Transistors for High-Speed and Low-Power Integrated-Circuit Applications (T Oka et al.); Prospects of InP-Based IC Technologies for 100-Gbit/S-Class Lightwave Communications Systems (T Enoki et al.); Scaling of InGaAs/InAlAs HBTs for High Speed Mixed-Signal and mm-Wave ICs (M J W Rodwell); Progress Toward 100 GHz Logic in InP HBT IC Technology (C H Fields et al.); Cantilevered Base InP DHBT for High Speed Digital Applications (A L Gutierrez-Aitken et al.); RSFQ Technology: Physics and Devices (P Bunyk et al.); RSFQ Technology: Circuits and Systems (D K Brock). Readership: Researchers, industrialists and academics in electrical and electronic engineering.


2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors

2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors
Author: Yue Kuo
Publisher: The Electrochemical Society
Total Pages: 350
Release: 2009-07
Genre: Science
ISBN: 1566777356

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This issue of ECS Transactions includes 33 papers that were presented at the Second International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT II), held in the Xi¿an Garden Hotel, Xian, China, July 5-10, 2009. This symposium was sponsored by the Engineering Conferences International.


Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Author: Yosi Shacham-Diamand
Publisher: Springer
Total Pages: 0
Release: 2014-11-28
Genre: Science
ISBN: 9781461497448

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In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.