Electronic Packaging Of High Speed Circuitry PDF Download
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Author | : Stephen G. Konsowski |
Publisher | : McGraw-Hill Professional Publishing |
Total Pages | : 488 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : |
Download Electronic Packaging of High Speed Circuitry Book in PDF, ePub and Kindle
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
Author | : R.R. Tummala |
Publisher | : Springer |
Total Pages | : 0 |
Release | : 2010-12-03 |
Genre | : Technology & Engineering |
ISBN | : 9789048150854 |
Download Electronic Packaging for High Reliability, Low Cost Electronics Book in PDF, ePub and Kindle
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
Author | : Stephen G. Konsowski |
Publisher | : McGraw Hill Professional |
Total Pages | : 488 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : 9780070359703 |
Download Electronic Packaging of High Speed Circuitry Book in PDF, ePub and Kindle
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
Author | : Luc Martens |
Publisher | : Springer Science & Business Media |
Total Pages | : 169 |
Release | : 2013-11-27 |
Genre | : Technology & Engineering |
ISBN | : 1461556236 |
Download High-Frequency Characterization of Electronic Packaging Book in PDF, ePub and Kindle
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Author | : Gerald A. Walker |
Publisher | : Springer |
Total Pages | : 342 |
Release | : 2013-12-11 |
Genre | : Technology & Engineering |
ISBN | : 1489973117 |
Download Advances in Electronic Circuit Packaging Book in PDF, ePub and Kindle
Author | : Glenn R. Blackwell |
Publisher | : CRC Press |
Total Pages | : 648 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 9781420049848 |
Download The Electronic Packaging Handbook Book in PDF, ePub and Kindle
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author | : Lawrence L. Rosine |
Publisher | : Springer |
Total Pages | : 303 |
Release | : 2013-12-01 |
Genre | : Technology & Engineering |
ISBN | : 1489973079 |
Download Advances in Electronic Circuit Packaging Book in PDF, ePub and Kindle
Author | : |
Publisher | : |
Total Pages | : 70 |
Release | : 1995 |
Genre | : |
ISBN | : |
Download Design Guidelines for Electronic Packaging Utilizing High-speed Techniques Book in PDF, ePub and Kindle
Author | : National Research Council |
Publisher | : National Academies Press |
Total Pages | : 154 |
Release | : 1990-02-01 |
Genre | : Technology & Engineering |
ISBN | : 030904233X |
Download Materials for High-Density Electronic Packaging and Interconnection Book in PDF, ePub and Kindle
Author | : |
Publisher | : |
Total Pages | : 394 |
Release | : 2004 |
Genre | : Electronic packaging |
ISBN | : |
Download Electrical Performance of Electronic Packaging Book in PDF, ePub and Kindle