Electronic Packaging PDF Download
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Author | : Yong Liu |
Publisher | : Springer Science & Business Media |
Total Pages | : 606 |
Release | : 2012-02-15 |
Genre | : Technology & Engineering |
ISBN | : 1461410533 |
Download Power Electronic Packaging Book in PDF, ePub and Kindle
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author | : Michael Pecht |
Publisher | : CRC Press |
Total Pages | : 120 |
Release | : 2017-12-19 |
Genre | : Technology & Engineering |
ISBN | : 1498730868 |
Download Electronic Packaging Materials and Their Properties Book in PDF, ePub and Kindle
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Author | : Xingcun Colin Tong |
Publisher | : Springer Science & Business Media |
Total Pages | : 633 |
Release | : 2011-01-05 |
Genre | : Technology & Engineering |
ISBN | : 1441977597 |
Download Advanced Materials for Thermal Management of Electronic Packaging Book in PDF, ePub and Kindle
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author | : Puligandla Viswanadham |
Publisher | : American Society of Mechanical Engineers |
Total Pages | : 0 |
Release | : 2011 |
Genre | : Technology & Engineering |
ISBN | : 9780791859667 |
Download Essentials of Electronic Packaging Book in PDF, ePub and Kindle
ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.
Author | : Hengyun Zhang |
Publisher | : Woodhead Publishing |
Total Pages | : 436 |
Release | : 2019-11-14 |
Genre | : Technology & Engineering |
ISBN | : 0081025335 |
Download Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore Book in PDF, ePub and Kindle
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
Author | : Mckeown |
Publisher | : CRC Press |
Total Pages | : 382 |
Release | : 1999-04-06 |
Genre | : Technology & Engineering |
ISBN | : 9780824770334 |
Download Mechanical Analysis of Electronic Packaging Systems Book in PDF, ePub and Kindle
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Author | : Charles A. Harper |
Publisher | : McGraw-Hill Companies |
Total Pages | : 1020 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : |
Download Electronic Packaging and Interconnection Handbook Book in PDF, ePub and Kindle
Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
Author | : Michael Pecht |
Publisher | : CRC Press |
Total Pages | : 904 |
Release | : 2018-10-24 |
Genre | : Technology & Engineering |
ISBN | : 1351838415 |
Download Handbook of Electronic Package Design Book in PDF, ePub and Kindle
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author | : John H. Lau |
Publisher | : McGraw-Hill Professional Publishing |
Total Pages | : 0 |
Release | : 1998 |
Genre | : Electronic packaging |
ISBN | : 9780070371354 |
Download Electronic Packaging Book in PDF, ePub and Kindle
Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state of the art. An absolute necessity for anyone working in the field, this "how-to" reference covers all the newest technologies, including BGA, Flip Chip, and CSP.
Author | : King-Ning Tu |
Publisher | : John Wiley & Sons |
Total Pages | : 340 |
Release | : 2021-12-29 |
Genre | : Science |
ISBN | : 1119418313 |
Download Electronic Packaging Science and Technology Book in PDF, ePub and Kindle
Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.