Design Fabrication And Characterization Of Beam Supported Aluminum Nitride Thin Film Bulk Acoustic Resonators PDF Download

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Design, Fabrication, and Characterization of Beam - Supported Aluminum Nitride Thin Film Bulk Acoustic Resonators

Design, Fabrication, and Characterization of Beam - Supported Aluminum Nitride Thin Film Bulk Acoustic Resonators
Author: Lori Ann Callaghan
Publisher:
Total Pages: 340
Release: 2005
Genre:
ISBN:

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Micro-mechanical filters comprised of bulk acoustic resonators are being fabricated and studied as a solution to the demands for low power consumption, high functionality devices in the telecommunication industry. A novel, suspended thin Film Bulk Acoustic wave Resonator (SFBAR) has been fabricated using an aluminum nitride film sputtered directly on a 100 silicon substrate. The suspended membrane design uses thin beams to support, as well as electrically connect, the resonator. The SFBAR has been fabricated by combining both thin film processing and bulk silicon micro machining. The AlN was etched in an Inductively Coupled Plasma (ICP) chlorine etch, using titanium dioxide as the masking material. A silicon Deep Reactive Ion Etch (DRIE) was used to create an open ended air cavity with a novel circular shape. A representative resonator, designated here as sample W9HS8 resonator 10018, was characterized with a Quality Factor values at resonance and anti-resonance of 68 and 151,


Acoustic Wave and Electromechanical Resonators

Acoustic Wave and Electromechanical Resonators
Author: Humberto Campanella
Publisher: Artech House
Total Pages: 364
Release: 2010
Genre: Technology & Engineering
ISBN: 1607839784

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This groundbreaking book provides you with a comprehensive understanding of FBAR (thin-film bulk acoustic wave resonator), MEMS (microelectomechanical system), and NEMS (nanoelectromechanical system) resonators. For the first time anywhere, you find extensive coverage of these devices at both the technology and application levels. This practical reference offers you guidance in design, fabrication, and characterization of FBARs, MEMS and NEBS. It discusses the integration of these devices with standard CMOS (complementary-metal-oxide-semiconductor) technologies, and their application to sensing and RF systems. Moreover, this one-stop resource looks at the main characteristics, differences, and limitations of FBAR, MEMS, and NEMS devices, helping you to choose the right approaches for your projects. Over 280 illustrations and more than 130 equations support key topics throughout the book.


Multilayer Integrated Film Bulk Acoustic Resonators

Multilayer Integrated Film Bulk Acoustic Resonators
Author: Yafei Zhang
Publisher: Springer Science & Business Media
Total Pages: 159
Release: 2012-08-28
Genre: Technology & Engineering
ISBN: 3642317766

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Mulilayer Integrated Film Bulk Acoustic Resonators mainly introduces the theory, design, fabrication technology and application of a recently developed new type of device, multilayer integrated film bulk acoustic resonators, at the micro and nano scale involving microelectronic devices, integrated circuits, optical devices, sensors and actuators, acoustic resonators, micro-nano manufacturing, multilayer integration, device theory and design principles, etc. These devices can work at very high frequencies by using the newly developed theory, design, and fabrication technology of nano and micro devices. Readers in fields of IC, electronic devices, sensors, materials, and films etc. will benefit from this book by learning the detailed fundamentals and potential applications of these advanced devices. Prof. Yafei Zhang is the director of the Ministry of Education’s Key Laboratory for Thin Films and Microfabrication Technology, PRC; Dr. Da Chen was a PhD student in Prof. Yafei Zhang’s research group.


Aluminum Nitride Thin Films - Deposition for Fabrication, Characterization and Fabrication of Surface Acoustic Wave Devices

Aluminum Nitride Thin Films - Deposition for Fabrication, Characterization and Fabrication of Surface Acoustic Wave Devices
Author: Charlee Fansler
Publisher:
Total Pages: 124
Release: 2008
Genre: Technology & Engineering
ISBN: 9783836469722

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Aluminum Nitride (AlN) thin films can be used for many device applications; for example, Surface Acoustic Wave (SAW) devices, microelectromechanical systems (MEMS) applications, and packaging applications. In this work, AlN is the critical layer in the fabrication process. One challenge is reliable deposition over wafer size substrates. The method of interest for deposition is pulsed DC sputtering. The (002) plane is the desired plane for its piezoelectric properties. The surface roughness of the deposited AlN is low and adheres well to the substrate. An AlN layer was deposited on a UNCD/Si substrate. Al was deposited on the AlN layer to form the IDTs (interdigital transducers) for SAW devices. SAW devices were fabricated on quartz - ST substrate. To verify the SAW devices work, they were tested using a network analyzer. This book discusses these results and parameters for AlN film deposition, film properties and implications for devices. This book would be beneficial for professionals, scientists, engineers, and graduate students in science and engineering working in the areas of wide bandgap semi-conductors, nitrides and piezoelectric materials and various acoustic wave devices.


MEMS Aluminum Nitride Technology for Inertial Sensors

MEMS Aluminum Nitride Technology for Inertial Sensors
Author: Gabriele Vigevani
Publisher:
Total Pages: 390
Release: 2011
Genre:
ISBN:

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The design and fabrication of MEMS Inertial Sensors (both accelerometers and gyroscopes) made of Aluminum Nitride (AlN) is described in this dissertation. The goal of this work is to design and fabricate inertial sensors based on c-axis oriented AlN polycrystalline thin films. AlN is a post-CMOS compatible piezoelectric material widely used for acoustic resonators, such Bulk Acoustic Wave (BAW) and Lamb Wave Resonators (LWR). In this work we develop the design techniques necessary to obtain inertial sensors with AlN thin film technology. Being able to use AlN as structural material for both acoustic wave resonator and sensing elements is key to achieve the three level integration of RF-MEMS components, sensing elements and CMOS in the same chip. Using AlN as integration platform is particularly suitable for large consumer emerging markets where production costs are the major factor that determine a product success. In order to achieve a platform integration, the first part of this work focuses on the fabrication process: starting from the fabrication technology used for LWR devices, this work shows that by slightly modifying some of the fabrication steps it is possible to obtain MEMS accelerometers and gyroscopes with the same structural layers used for LWR. In the second part of this work, an extensive analysis, performed with analytical and Finite Element Models (FEM), is developed for beam and ring based structures. These models are of great importance as they provide tools to understand the physics of lateral piezoelectric beam actuation and the major limitations of this technology. Based on the models developed for beam based resonators, we propose two designs for Double Ended Tuning Fork (DETF) based accelerometers. In the last part of the dissertation, we show the experimental results and the measurements performed on actual devices. As this work shows analytically and experimentally, there are some fundamental constraints that limit the ultimate sensitivity of piezoelectric sensors based on resonating beam structures. Although the limitations of the structures here considered cannot achieve tactical grade sensitivities, this research proves that it is possible to achieve performances close to those required by large consumer electronics. This work proves that AlN based platforms can be a great opportunity for future developments in IMU and in general for MEMS integrated solutions.


Temperature-Compensated and High-Q Piezoelectric Aluminum Nitride Lamb Wave Resonators for Timing and Frequency Control Applications

Temperature-Compensated and High-Q Piezoelectric Aluminum Nitride Lamb Wave Resonators for Timing and Frequency Control Applications
Author: Chih-Ming Lin
Publisher:
Total Pages: 384
Release: 2013
Genre:
ISBN:

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The explosive development of wireless and mobile communication systems has lead to rapid technology innovation in component performance, complementary metal-oxide semiconductor (CMOS) compatible fabrication techniques, and system improvement to satisfy requirements for faster signal processing, cost efficiency, chip miniaturization, and low power consumption. The demands for the high-performance communication systems whose fundamentals are precise timing and frequency control have driven the current research interests to develop advanced reference oscillators and radio frequency (RF) bandpass filters. In turn a promising microelectromechanical systems (MEMS) resonator technology is required to achieve the ultimate goal. That is, micromechanical vibrating resonators with high quality factor (Q) and good frequency-temperature stability at high series resonance frequency (fs) are the required fundamental components for a high-performance wireless communication system. Recently, Lamb wave mode propagating in piezoelectric thin plates has attracted great attention for designs of the electroacoustic resonators since it combines the advantages of bulk acoustic wave (BAW) and surface acoustic wave (SAW): high phase velocity and multiple frequency excitation by an interdigital transducer (IDT). More specifically, the Lamb wave resonator (LWR) based on an aluminum nitride (AlN) thin film has attracted many attentions because it can offer the high resonance frequency, small temperature-induced frequency drift, low motional resistance, and CMOS compatibility. The lowest-order symmetric (S0) Lamb wave mode propagation in the AlN thin plate is particularly preferred because it exhibits a phase velocity close to 10,000 m/s, a low dispersive phase velocity characteristic, and a moderate electromechanical coupling coefficient. However, the uncompensated AlN LWR shows a first-order temperature coefficient of frequency (TCF) of approximately -25 ppm/C. This level of the temperature stability is unsuitable for any timing application. In addition, the Q of the AlN LWR is degraded to several hundred while the IDT finger width is downscaled to a nanometer scale to raise the resonance frequency up to a few GHz. This dissertation presents comprehensive analytical and experimental results on a new class of temperature-compensated and high-Q piezoelectric AlN LWRs. The temperature compensation of the AlN LWR using the S0 Lamb wave mode is achieved by adding a layer of silicon dioxide (SiO2) with an appropriate thickness ratio to the AlN thin film, and the AlN/SiO2 LWRs can achieve a low first-order TCF at room temperature. Based on the multilayer plate composed of a 1-um-thick AlN film and a 0.83-um-thick SiO2 layer, a temperature-compensated LWR operating at a series resonance frequency of 711 MHz exhibits a zero first-order TCF and a small second-order TCF of -21.5 ppb/C^2 at its turnover temperature, 18.05 C. The temperature dependence of fractional frequency variation is less than 250 parts per million (ppm) over a wide temperature range from -55 to 125 C. In addition to the temperature compensation at room temperature, the thermal compensation of the AlN LWRs is experimentally demonstrated at high temperatures. By varying the normalized AlN and SiO2 thicknesses to the wavelength, the turnover temperature can be designed at high temperatures and the AlN LWRs are temperature-compensated at 214, 430, and 542 C, respectively. The temperature-compensated AlN/SiO2 LWRs are promising for a lot of applications including thermally stable oscillators, bandpass filters, and sensors at room temperature as well as high temperatures. The influences of the bottom electrode upon the characteristics of the LWRs utilizing the S0 Lamb wave mode in the AlN thin plate are theoretically and experimentally studied. Employment of a floating bottom electrode for the LWR reduces the static capacitance in the AlN membrane and accordingly enhances the effective coupling coefficient. The floating bottom electrode simultaneously offers a large coupling coefficient and a simple fabrication process than the grounded bottom electrode but the transduction efficiency is not sacrificed. In contrast to those with the bottom electrode, an AlN LWR with no bottom electrode shows a high Q of around 3,000 since it gets rid of the electrical loss in the metal-to-resonator interface. In addition, it exhibits better power handling capacity than those with the bottom electrode since less thermal nonlinearity induced by the self-heating exists in the resonators. In order to boost the Q, a new class of the AlN LWRs using suspended convex edges is introduced in this dissertation for the first time. The suspended convex edges can efficiently reflect the Lamb waves back towards the transducer as well as confine the mechanical energy in the resonant body. Accordingly the mechanical energy dissipation through the support tethers is significantly minimized and the Q can be markedly enhanced. More specifically, the measured frequency response of a 491.8-MHz LWR with suspended biconvex edges yields a Q of 3,280 which represents a 2.6x enhancement in Q over a 517.9-MHz LWR based on the same AlN thin plate but with the suspended flat edges. The suspended convex edges can efficiently confine mechanical energy in the LWR and reduce the energy dissipation through the support tethers without increasing the motional impedance of the resonator. In addition, the radius of curvature of the suspended convex edges and the AlN thickness normalized to the wavelength can be further optimized to simultaneously obtain high Q, low motional impedance, and large effective coupling coefficient. To further enhance the Q of the LWR, a composite plate including an AlN thin film and an epitaxial cubic silicon carbide (3C-SiC) layer is introduced to enable high-Q and high-frequency micromechanical resonators utilizing high-order Lamb wave modes. The use of the epitaxial 3C-SiC layer is attractive as SiC crystals have been theoretically proven to have an exceptionally large fs and Q product due to its low acoustic loss characteristic at microwave frequencies. In addition, AlN and 3C-SiC have well-matched mechanical and electrical properties, making them a suitable material stack for the electroacoustic resonators. The epitaxial 3C-SiC layer not only provides the micromechanical resonators with a low acoustic loss layer to boost their Q but also enhances the electromechanical coupling coefficients of some high-order Lamb waves in the AlN/3C-SiC composite plate. A micromachined electroacoustic resonator utilizing the third quasi-symmetric (QS3) Lamb wave mode in the AlN/3C-SiC composite plate exhibits a Q of 5,510 at 2.92 GHz, resulting in the highest fs and Q product, 1.61x10^13 Hz, among suspended piezoelectric thin film resonators to date.


Aluminum Nitride Thin Film and Composite Bulk Wave Resonators

Aluminum Nitride Thin Film and Composite Bulk Wave Resonators
Author: K. M. Lakin
Publisher:
Total Pages: 8
Release: 1982
Genre:
ISBN:

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The fundamental material and device properties of miniature bulk wave resonators have been investigated for fundamental mode oscillator control and filter applications in the UHF range. The properties of aluminum nitride in the composite resonator geometry and in an edge-only supported plate configuration are reported. The AlN films were grown in a DC planar magnetron sputtering system using the plasma reaction between sputtered Al from the target and N2 in the plasma. The general sputtering conditions were as follows: substrate temperature equal 200 C, atmospheric gas equal 99.999% Nitrogen, sputtering pressure: 1 x 10 to the minus third power torr, DC power equal 225 watts and deposition rate equal 1.2 micrometer/hr. The films were evaluated by SEM, x-ray diffraction, and Auger electron spectroscopy. These results showed that the sputtered AlN films have a highly oriented structure with the c-axis normal to the surface of the Si substrate.