Curing At The Speed Of Light PDF Download

After the development of ultraviolet (UV) curing technology, a novel method to manufacture abrasive tools using UV light curing technique was proposed. After decades of research activities, the UV-cured resin bond tools have been studied and proven to have substantial advantages. However, very little researches has been done to study the mechanism of such abrasive tools. In this study, the mechanism of UV-cured resin bond diamond tools was proposed as a Grind/Lap (G/L) process and an experimental method was used to verify the mechanism. Furthermore, the models of surface roughness (RA) and material removal rate (MRR) in the process of ceramics have been intensively investigated. The traditional way to fabricate abrasive tools is by utilizing the thermosetting method. The mixture of abrasives and bond material is sintered at high temperature under extremely high pressure, and it is a time consuming and costly procedure. However, for the UV-curing technique, after being exposed to UV light with a certain intensity, the abrasive-mixed resin can be solidified in a short time. The process is environmentally friendly and has strong productivity advantages but coupled with low energy consumption. The purpose of this research is to understand fundamental issues in UV-curable resin and face grinding of ceramic materials using UV-cured resin bond wheels, including to study the kinematics of face grinding (grinding with lapping kinematics) and the properties of UV-cured abrasive-mixed resin, verify the mechanism proposed for grind/lap process and investigate the effects of several factors on the performance of UV-cured resin bond wheel for aluminum oxide ceramics. The kinematic relation between the workpiece, workpiece holder and the wheel were investigated. The trajectories generated under different speed combinations were simulated. Based on the trace distribution, a combination of the speed of wheel and holder can be suggested and an explanation of interactional effect of the wheel and holder speed was given. The resin 425 was selected by comparing the properties of two resins. The effects of UV-curing time and diamond concentrations on the characteristics of abrasive-mixed resin were studied. The concentration of 12.5 wt. % was selected to investigate the effect of curing time on the performance of resin bond diamond wheel. By studying the abrasive distribution on the surface of abrasive-mixed resin and literature review, the mechanism of the G/L process was proposed as a hybrid of grinding and lapping, with the grinding dominant at the beginning; as machining time increases, the abrasives of small size are released and the G/L process becomes a lapping dominant process (three-body abrasion). In order to prove the proposed mechanism, three experiments performing grinding, lapping, and grind/lap processes were designed. The relation between RA and machining time in three operations agreed with the proposed mechanism, and the outputs of Zygo and SEM of the workpiece surface showed high correspondence with the RA gained respectively. Therefore, the mechanism for the G/L process was validated. Four parameters, including the wheel speed, holder speed, pressure applied, and the UV-curing time, were selected to study the models of RA and MRR in the G/L process for AL2O3 ceramics. The ANOVA results indicated that the four factors and the interaction effect of W*H have significant effects on RA and MRR. The first-order and second-order models with the significant factor terms were established after a logarithmic transformation. The coefficient of determination R2 and the prediction in error showed that the second-order model explained more variability of the experiment response. The quadratic models of RA and MRR were selected for predicting responses with different factor levels. The errors between the experiment values and values obtained by the model were within a reasonable range, which indicates that these two models are accurate. Therefore, these models can be used to predict the surface roughness and material removal rate for the G/L process.