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Compact Models and Performance Investigations for Subthreshold Interconnects

Compact Models and Performance Investigations for Subthreshold Interconnects
Author: Rohit Dhiman
Publisher: Springer
Total Pages: 122
Release: 2014-11-07
Genre: Technology & Engineering
ISBN: 813222132X

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The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.


Advances in VLSI and Embedded Systems

Advances in VLSI and Embedded Systems
Author: Anand D. Darji
Publisher: Springer Nature
Total Pages: 293
Release: 2022-11-30
Genre: Technology & Engineering
ISBN: 9811967806

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This book presents select peer-reviewed proceedings of the 2nd International Conference on Advances in VLSI and Embedded Systems (AVES 2021). This book covers cutting-edge original research in VLSI design, devices and emerging technologies, embedded systems, and CAD for VLSI. To address the demand for complex and high-functionality systems as well as portable consumer electronics, the contents focus on advanced topics of circuit and systems design, fabrication, testing, and standardization. This book is useful for students, researchers as well as industry professionals interested in emerging trends in VLSI and embedded systems.


Compact Models and Measurement Techniques for High-Speed Interconnects

Compact Models and Measurement Techniques for High-Speed Interconnects
Author: Rohit Sharma
Publisher: Springer
Total Pages: 69
Release: 2012-02-17
Genre: Technology & Engineering
ISBN: 9781461410720

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Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.


CMOS VLSI Engineering

CMOS VLSI Engineering
Author: James B. Kuo
Publisher: Springer Science & Business Media
Total Pages: 816
Release: 1998-09-30
Genre: Computers
ISBN: 9780792382720

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Silicon-On-Insulator (SOI) CMOS technology has been regarded as another major technology for VLSI in addition to bulk CMOS technology. Owing to the buried oxide structure, SOI technology offers superior CMOS devices with higher speed, high density, and reduced second order effects for deep-submicron low-voltage, low-power VLSI circuits applications. In addition to VLSI applications, and because of its outstanding properties, SOI technology has been used to realize communication circuits, microwave devices, BICMOS devices, and even fiber optics applications. CMOS VLSI Engineering: Silicon-On-Insulator addresses three key factors in engineering SOI CMOS VLSI - processing technology, device modelling, and circuit designs are all covered with their mutual interactions. Starting from the SOI CMOS processing technology and the SOI CMOS digital and analog circuits, behaviors of the SOI CMOS devices are presented, followed by a CAD program, ST-SPICE, which incorporates models for deep-submicron fully-depleted mesa-isolated SOI CMOS devices and special purpose SOI devices including polysilicon TFTs. CMOS VLSI Engineering: Silicon-On-Insulator is written for undergraduate senior students and first-year graduate students interested in CMOS VLSI. It will also be suitable for electrical engineering professionals interested in microelectronics.


Nano Interconnects

Nano Interconnects
Author: Afreen Khursheed
Publisher: CRC Press
Total Pages: 187
Release: 2021-12-23
Genre: Technology & Engineering
ISBN: 100050431X

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This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.


Scientific and Technical Aerospace Reports

Scientific and Technical Aerospace Reports
Author:
Publisher:
Total Pages: 602
Release: 1995
Genre: Aeronautics
ISBN:

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Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.


Research and Technology Program Digest

Research and Technology Program Digest
Author: United States. National Aeronautics and Space Administration
Publisher:
Total Pages: 792
Release:
Genre:
ISBN:

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Processor and System-on-Chip Simulation

Processor and System-on-Chip Simulation
Author: Rainer Leupers
Publisher: Springer Science & Business Media
Total Pages: 343
Release: 2010-09-15
Genre: Technology & Engineering
ISBN: 1441961755

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Simulation of computer architectures has made rapid progress recently. The primary application areas are hardware/software performance estimation and optimization as well as functional and timing verification. Recent, innovative technologies such as retargetable simulator generation, dynamic binary translation, or sampling simulation have enabled widespread use of processor and system-on-chip (SoC) simulation tools in the semiconductor and embedded system industries. Simultaneously, processor and SoC simulation is still a very active research area, e.g. what amounts to higher simulation speed, flexibility, and accuracy/speed trade-offs. This book presents and discusses the principle technologies and state-of-the-art in high-level hardware architecture simulation, both at the processor and the system-on-chip level.