Chemical Mechanical Planarization Of Copper Thin Films PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Chemical Mechanical Planarization Of Copper Thin Films PDF full book. Access full book title Chemical Mechanical Planarization Of Copper Thin Films.
Author | : Suresh Kumar Govindaswamy |
Publisher | : |
Total Pages | : 416 |
Release | : 2006 |
Genre | : Chemical mechanical planarization |
ISBN | : |
Download Chemical Mechanical Planarization of Copper Thin Films Book in PDF, ePub and Kindle
Author | : Joseph M. Steigerwald |
Publisher | : |
Total Pages | : 56 |
Release | : 1993 |
Genre | : |
ISBN | : |
Download Chemical Mechanical Polishing of Copper Thin Films Book in PDF, ePub and Kindle
Author | : Srikanth Sundararaajan |
Publisher | : |
Total Pages | : 152 |
Release | : 1997 |
Genre | : |
ISBN | : |
Download Experiments and Models for the Chemical Mechanical Polishing of Copper Thin Films Book in PDF, ePub and Kindle
Author | : Ying Li |
Publisher | : |
Total Pages | : 374 |
Release | : 2001 |
Genre | : Copper |
ISBN | : |
Download Mechanisms of Chemical-mechanical Planarization of Copper/tantalum Thin Films Using Fumed Silica Abrasives Book in PDF, ePub and Kindle
Author | : Joseph M. Steigerwald |
Publisher | : |
Total Pages | : 203 |
Release | : 1995 |
Genre | : |
ISBN | : |
Download A Fundamental Study of Chemical Mechanical Polishing of Copper Thin Films Book in PDF, ePub and Kindle
Author | : Rajesh Badri |
Publisher | : |
Total Pages | : 72 |
Release | : 2003 |
Genre | : Copper |
ISBN | : |
Download A Study of Chemical Mechanical Polishing (CMP) of the Sputter Deposited Copper and Tantalum Thin Films Book in PDF, ePub and Kindle
Author | : Veera Raghava R. Kakireddy |
Publisher | : |
Total Pages | : |
Release | : 2007 |
Genre | : |
ISBN | : |
Download Effect of Temperature on Copper Chemical Mechanical Planarization Book in PDF, ePub and Kindle
ABSTRACT: The effects of different process parameters on tribology and surface defects were studied till date, but there has been a very minimal study to understand the effect of slurry temperature during Copper Chemical Mechanical Polishing (CMP). The surface defects such as dishing, erosion and metal loss amount for more than 50% of the defects that hamper the device yield and mainly the electrical properties during the manufacturing process. In this research, the effect of slurry temperature on tribology, surface defects and electrical properties during copper CMP employing different pad materials and slurries has been explored. Experiments were conducted at different slurry temperatures maintaining all the other process parameters constant. Post polished copper samples were analyzed for their dishing and metal loss characteristics. From the results, it was seen that the coefficient of friction and removal rate increased with increase in slurry temperature during polishing with both types of polishing pads. This increase in removal rate is attributed to a combined effect of change in pad mechanical properties and chemical reaction kinetics. The experimental data indicated that the increase in slurry temperature results in an increase in amounts of metal dishing and copper metal loss for one type of slurry and defects decrease with increase in slurry temperature for other type of slurry. This phenomenon indicates the effect of temperature on chemical reaction kinetics and its influence on defect generation. This can be attributed due to the change in pad asperities due to change in pad mechanical properties and chemical kinetics with change in slurry temperature. The slurry temperature has an effect not only on the surface defects and tribology but also on the change in pad mechanical properties. The copper thin films peeled off at higher polishing temperatures, leading to adhesion failure. With increase in temperature the copper crystallinity, hardness and modulus increased. Further with increase in the defects the electrical properties of the devices also degraded drastically and even failed to operate at higher levels of dishing and metal loss. This research is aimed at understanding the physics governing the defect generation during CMP.
Author | : Qiuliang Luo |
Publisher | : |
Total Pages | : 416 |
Release | : 1997 |
Genre | : Copper |
ISBN | : |
Download Chemical Mechanical Polishing of Thin Copper Films Book in PDF, ePub and Kindle
Author | : M.R. Oliver |
Publisher | : Springer Science & Business Media |
Total Pages | : 432 |
Release | : 2013-03-14 |
Genre | : Technology & Engineering |
ISBN | : 3662062348 |
Download Chemical-Mechanical Planarization of Semiconductor Materials Book in PDF, ePub and Kindle
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author | : G. S. Mathad |
Publisher | : The Electrochemical Society |
Total Pages | : 438 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : 9781566773935 |
Download Thin Film Materials, Processes, and Reliability Book in PDF, ePub and Kindle