Adhesion In Microelectronics PDF Download
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Author | : K. L. Mittal |
Publisher | : John Wiley & Sons |
Total Pages | : 293 |
Release | : 2014-08-25 |
Genre | : Technology & Engineering |
ISBN | : 1118831349 |
Download Adhesion in Microelectronics Book in PDF, ePub and Kindle
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Author | : James J. Licari |
Publisher | : William Andrew |
Total Pages | : 415 |
Release | : 2011-06-24 |
Genre | : Technology & Engineering |
ISBN | : 1437778909 |
Download Adhesives Technology for Electronic Applications Book in PDF, ePub and Kindle
Approx.512 pages Approx.512 pages
Author | : Xiang Dai |
Publisher | : |
Total Pages | : 328 |
Release | : 1998 |
Genre | : Microelectronic packaging |
ISBN | : |
Download Materials study for interfacial adhesion and reliability of microelectronics packaging structures Book in PDF, ePub and Kindle
Author | : B. G. Yacobi |
Publisher | : American Scientific Publishers |
Total Pages | : 200 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : |
Download Adhesive Bonding in Photonics Assembly and Packaging Book in PDF, ePub and Kindle
Author | : George G. Harman |
Publisher | : McGraw Hill Professional |
Total Pages | : 290 |
Release | : 1997 |
Genre | : Technology & Engineering |
ISBN | : 9780070326194 |
Download Ire Bonding in Microelectronics Book in PDF, ePub and Kindle
The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch
Author | : A. Christou |
Publisher | : RIAC |
Total Pages | : 410 |
Release | : 2006 |
Genre | : Microelectronics |
ISBN | : 1933904151 |
Download Reliability and Quality in Microelectronic Manufacturing Book in PDF, ePub and Kindle
Author | : Tomi Laurila |
Publisher | : Springer Science & Business Media |
Total Pages | : 221 |
Release | : 2012-01-10 |
Genre | : Technology & Engineering |
ISBN | : 1447124707 |
Download Interfacial Compatibility in Microelectronics Book in PDF, ePub and Kindle
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Author | : George G. Harman |
Publisher | : |
Total Pages | : 116 |
Release | : 1974 |
Genre | : Microelectronics |
ISBN | : |
Download Microelectronic Ultrasonic Bonding Book in PDF, ePub and Kindle
Author | : Helmut Baumgart |
Publisher | : The Electrochemical Society |
Total Pages | : 398 |
Release | : 2006 |
Genre | : Microelectromechanical systems |
ISBN | : 156677506X |
Download Semiconductor Wafer Bonding 9: Science, Technology, and Applications Book in PDF, ePub and Kindle
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author | : Charles E. Hunt |
Publisher | : The Electrochemical Society |
Total Pages | : 496 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 9781566772587 |
Download Semiconductor Wafer Bonding : Science, Technology, and Applications V Book in PDF, ePub and Kindle